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Showing posts with the label memory

Inside SK Hynix's Japan Strategy: Fabs, Targeted M&A, and the US-Korea-Japan Memory Triad

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Global Supply Chain & Semiconductor Alliances SK Hynix Targets Japan for Memory Hub Expansion: Inside the Emerging Korea-Japan Semiconductor Alliance Published: 02 Sep 2026 | Global Semiconductor Supply Chain & Geopolitical Strategy 📌 SK Hynix Japan Expansion & Alliance Drivers Strategic Scope Fab, JV & M&A Nationwide Site Review Ecosystem Synergy TEL & Kioxia Materials & Capital Stake Geopolitical Triad US-KR-JP Global Supply Chain Array In a strategic move to fortify its global AI memory supply chain, SK Hynix is actively evaluating Japan as a primary overseas production and material ecosystem hub. As confirmed by SK Group Chairman Chey Tae-won and SK Hynix CEO Kwak Noh-jung, the company is considering a multi-faceted approach encompassing greenfield fab construction, joint ventures (JVs), co...

Inside the $837B Memory Supercycle: Gartner Projects Memory to Capture 54% of Global Semiconductor Market

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Global Semiconductor Market Intelligence Gartner Forecasts 280% Surge in Memory Revenue as Global Chip Market Crosses $1.55 Trillion Published: 26 Aug 2026 | Gartner Industry Forecast & Memory Supercycle Analytics 📌 Gartner 2026 Global Semiconductor Outlook Total Semi Revenue $1.555T +92% YoY ($1.94T in 2027) Memory Revenue $837.3B +280% YoY Growth Memory Share of Total 54% Up from 27% in 2025 Defying premature concerns of a cyclical semiconductor downturn, leading technology market research firm Gartner released a benchmark forecast projecting that global memory semiconductor revenue will surge 280% year-over-year to $837.3 billion in 2026. Driven by compounding AI datacenter infrastructure investments, memory's share of total worldwide semiconductor revenues is set to surpass the majority threshold, climbing fr...

Samsung & SK Hynix Deploy 50T KRW in H1 CapEx as AI Memory Equipment Commitments Double

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Capital Expenditure & Fab Infrastructure Samsung & SK Hynix Deploy 50T KRW in H1 CapEx as AI Memory Equipment Commitments Double Published: 19 Aug 2026 | Global Semiconductor CapEx & WFE Analytics 📌 H1 2026 Capital Deployment & Pipeline Combined H1 CapEx Outlay 49.56T KRW +32.4% YoY (Tangible Asset Purchases) Purchase Commitments 92.03T KRW Samsung +121% | SK Hynix +602% To meet unprecedented hyperscaler demand for next-generation AI memory, Samsung Electronics and SK Hynix poured approximately 50 trillion KRW ($36.5B) into tangible asset acquisitions during the first half of 2026. Official semi-annual filings indicate that contractual purchase commitments for future fab tools have more than doubled year-over-year, underscoring an aggressive race to lock in cleanroom capacity. 1. Record H1 Tangible Asset Deployment Focused on Advanced Fabs ...